Simulation of Electric Field Distribution along the Trench of PCB board and IGBT baseplate Model
Publication Date : 24/01/2020
This paper presents a simulation analysis of discharges on the trench of PCB board in oil under ac voltage. The analysis is compared with a similar simulation of ceramic substrate used as a baseplate in IGBT modules. The electric field strength at the triple junction region of the high voltage electrode, solid insulation, and the insulating fluid may result in the field emission of initial electrons. In an insulation liquid without impurity, electron emission around the highly stressed region along the trench is responsible for discharge initiation. Discharge around the region is dependent on the properties of the solid insulation. The presence of contamination leads to distortion of the electric field distribution. Simulation of air and water bubbles along the trench shows a significant change in the electric field distribution. Water contamination would be a dominant contributor to discharge development.
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